2
Publications
44
Citations
2
H-Index
2023
Active since
Affiliations
Koki Onishi is an author at University of Tsukuba specializing in materials engineering, electronic packaging, and microelectronics.
Top concepts
ChemistryEngineeringApplied PhysicsSurface ScienceMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringElectrical Engineering
Publications per year
2023–2024
2
2
Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding
Fumihiro Inoue, Shunsuke Teranishi, Tomoya Iwata et al. · 2023 · 24 citations
Rows per page
1–2 of 2