Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders - Concepedia

Concepedia

Publication | Open Access

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

DOI Full Paper Access

59

Citations

30

References

2015

Year

Jianchun Liu, Gong Zhang, Zhenghong Wang, Jusheng Ma, Katsuaki Suganuma

Materials & Design

Materials EngineeringMaterials ScienceEngineeringLow-temperature Lead-free SoldersApplied PhysicsAlloy DesignAlloy PhaseThermal PropertyInterfacial Characterization

References

	Year	Citations

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