Interweaved filler network in epoxy resin with reduced interface thermal resistance via in-situ high-temperature “welding” for significantly improved thermal conductivity

Yani Lu, Xinwei Xu, Li Li, Jiufeng Dong, Renchao Hu, Wenjin Chen, Weishu Liu, Hong Wang

Chemical Engineering Journal · 2024 · 11 citations · 46 references

Concepts

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