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Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials

EngineeringMechanical EngineeringThermal Contact AnalysisAdvanced Packaging (Semiconductors)Flip-chip PackageThermal AnalysisThermodynamicsThermal ConductionElectronic PackagingMaterials ScienceMicroscopic ContactsChip AttachmentHeat TransferMicroelectronicsChip-scale PackageMicrofabricationSurface ScienceApplied PhysicsThermal Engineering