Zongkun Pan

Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials

Chen Wang, Qiyin Lin, Zongkun Pan et al. · Applied Energy · 2023 · 40 citations

Engineering, Electrical Engineering, Materials Engineering +17

Effect of load application method on thermal contact resistance and uniformity of temperature distribution

Chen Wang, Qiyin Lin, Jun Hong et al. · Applied Thermal Engineering · 2023 · 33 citations

Engineering, Materials Science, Mechanical Engineering +16

Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package

Chen Wang, Zongkun Pan, Kai‐Yi Zhou et al. · Applied Thermal Engineering · 2024 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17

Effect of the secondary microcontact state induced by the all-factor thermal effect on bidirectional thermal contact performance

Chen Wang, Qiyin Lin, Zongkun Pan et al. · International Communications in Heat and Mass Transfer · 2023 · 15 citations

Engineering, Mechanical Engineering, Physics +14