Enhancing ceria slurry performance for shallow trench isolation chemical mechanical polishing through non-ionic surfactant addition

Chemical mechanical glass polishing with cerium oxide: Effect of selected physico-chemical characteristics on polishing efficiency

Pavel Janoš, Jakub Ederer, Věra Pilařová et al. · Wear · 2016 · 105 citations

Engineering, Materials Engineering, Materials Science +14

Cerium Oxide Slurries in CMP. Electrophoretic Mobility and Adsorption Investigations of Ceria/Silicate Interaction

Preuchsuda Suphantharida, K. Osseo‐Asare · Journal of The Electrochemical Society · 2004 · 89 citations

Natural Sciences, Chemistry, Materials Science +17

Direct and quantitative study of ceria–SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning

Kyong Kyu Myong, Jinuk Byun, Min‐Ju Choo et al. · Materials Science in Semiconductor Processing · 2020 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +16

Abrasive and additive interactions in high selectivity STI CMP slurries

BVS Praveen, R. Manivannan, T. D. Umashankar et al. · Microelectronic Engineering · 2013 · 45 citations

Engineering, Materials Engineering, Materials Science +13

Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

P. R. Dandu Veera, Shivaji Peddeti, S. V. Babu · Journal of The Electrochemical Society · 2009 · 44 citations · Full text

Engineering, Chemical Engineering, Materials Science +17