Physics-of-degradation-based life prediction of solder interconnects of long-life solar arrays in low-earth orbit

An internal variable constitutive model for hot working of metals

Stuart C. Brown, K KIM, Lallit Anand · International Journal of Plasticity · 1989 · 763 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Constitutive equations for hot-working of metals

Lallit Anand · International Journal of Plasticity · 1985 · 594 citations

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Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

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Reliability of Controlled Collapse Interconnections

K. C. Norris, Abraham H. Landzberg · IBM Journal of Research and Development · 1969 · 483 citations

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Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

G. Z. Wang, Zhilin Cheng, Karl‐Friedrich Becker et al. · Journal of Electronic Packaging · 1998 · 313 citations

Natural Sciences, Materials Engineering, Materials Science +17