Technologies for Forming Electrodynamic Structures for Millimeter-Wave and Terahertz Vacuum Microelectronic Devices (Review)

Abstract

The electrodynamic microstructure technologies for production of millimeter and submillimeter-wave vacuum microelectronic devices are reviewed, including photolithography, deep reactive ion etching, computer numerical control micro- and nanomilling, electro-erosive micromachining, and additive technologies: 3D printing, selective laser sintering, and selective laser melting. An original approach to manufacture of planar slow-wave systems based on magnetron sputtering and laser ablation is discussed. Technological tolerances and surface roughness that can be obtained using the considered technologies are compared.