Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Abstract

The paper presents experimental investigations on both power and thermal cycling conditions on 600 V-200 A six-pack IGBT power modules. Both types of cycles are compared in term of thermo- mechanical stresses by using finite element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.