Concepedia

Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation

Nicholas May, Hongbin Choi, Adrian Phoulady, Yara Suleiman, Daniel DiMase, Pouya Tavousi, Sina Shahbazmohamadi

Microelectronics Reliability · 2022 · 12 citations · 3 references

DOI

Concepts

References

3

Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis

Joseph Favata, Sina Shahbazmohamadi · Microelectronics Reliability · 2018 · 17 citations

, , +14

A novel material detection method using femtosecond laser, confocal imaging and image processing enabling endpointing in fast inspection of microelectronics

Adrian Phoulady, Nicholas May, Hongbin Choi et al. · Microelectronics Reliability · 2021 · 13 citations

, , +17

Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations

A. Aubert, L. Dantas de Morais, J.-P. Rebrassé · Microelectronics Reliability · 2008 · 10 citations

, , +15