Improvement of trade-off between mechanical properties and dielectric of polyimide with surface modified silica nanoparticle for wafer level packaging

Jinsu Kim, Seung‐Ho Baek, Juheon Lee, Sangrae Lee, Chanjae Ahn, Jinyoung Kim, Haksoo Han

Journal of Industrial and Engineering Chemistry · 2022 · 13 citations · 20 references

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