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Boosting the Memory Window of the BEOL-Compatible MFMIS Ferroelectric/ Anti-Ferroelectric FETs by Charge Injection

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2022

Year

Abstract

By careful design of the area ratio (AR) of the BEOL-compatible MFMIS Fe/AFe-FET, we modulate the charge injection in the gate stack and successfully push the memory window (MW) of Fe-FET to ~8 V, far beyond the theoretical limit. As for AFe-FET, MW up to ~3 V further confirms the influence of the charging effect. While decent endurance of Fe-FETs with very large MW is obtained, the AFe-FETs with non-volatile characteristics hold great promise for ultra-high endurance operation. To take full advantage of these properties, we propose a scaling strategy implementing a channel-all-around (CAA) vertical device with the MFMIS structure, which is proved to have intrinsic large AR through simulation. At last, a novel image encryption application with outstanding area and energy efficiency is demonstrated thanks to the proposed high-density integration method and the multistate features of Fe-FETs.