2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 21 citations · 1 references
EngineeringElectrical EngineeringHigh-performance ComputingInternet Of ThingsOpticsPhotonicsChip PackagingFiber OpticsIntegrated OpticsIntegrated PhotonicsOptical Communication SystemsOptical InterconnectsAdvanced PackagingBandwidthCo-packaged OpticsDevice PackagingOptical Communication LinksOptical PackagingOptical Wireless CommunicationPower Consumption
With regard to strong demands of internet of things (IoT), 5 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sup> generation wireless 5G, metaverse, and so on, optical communication plays an important role in datacenter and high-performance computing (HPC) application. In this article, we discuss the packaging technologies in terms of assembly and test aimed to realize the co-packaged optics, and to fulfill the requests of high bandwidth and low power consumption when transferring high speed data.
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