Applied Physics Express · 2022 · 53 citations · 33 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsOptoelectronicsSemiconductor DevicesDislocations In SemiconductorsLight-emitting DiodesOptical Thin FilmsSemiconductor Crystal GrowthSemiconductor Device MaterialsSemiconductor SurfacesDevice FabricationEncapsulationExternal Quantum EfficiencyLight-emitting DevicesMetalorganic Vapor Phase EpitaxySputter DepositionSurface Deterioration
Abstract Regarding deep-ultraviolet optical device applications, face-to-face annealed sputter-deposited AlN (FFA Sp-AlN) is a promising alternative to the conventional metalorganic vapor phase epitaxy (MOVPE)-prepared AlN templates on sapphire substrates. However, FFA Sp-AlN tends to exhibit AlGaN growth-related hillock generation and surface morphology deterioration. In this study, we optimized the sputter-deposition conditions for AlN and MOVPE growth conditions for AlGaN to respectively reduce hillock density and size. After confirming AlGaN surface-flattening, we fabricated 263 nm wavelength UV-C LEDs on the FFA Sp-AlN and achieved maximum external quantum efficiencies of approximately 4.9% and 8.0% without and with silicone encapsulation, respectively.
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The emergence and prospects of deep-ultraviolet light-emitting diode technologies
Michael Kneissl, Tae‐Yeon Seong, Jung Han et al. · Nature Photonics · 2019 · 1.3K citations
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