Publication | Closed Access
Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis
27
Citations
8
References
2006
Year
Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Electromigration TechniqueHardware ReliabilityChip AttachmentElectromigration ReliabilityFlip-chip PackagesElectronic PackagingMicroelectronicsElectrothermal Coupling Analysis
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