Publication | Closed Access
Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics
14
Citations
36
References
2022
Year
Electrical EngineeringEngineeringHigh Power ElectronicsAdvanced Packaging (Semiconductors)Bias Temperature InstabilityDevice ReliabilityCircuit ReliabilityElectronic PackagingHeat TransferThermal EngineeringDbac SubstratesElectrical Insulation
| Year | Citations | |
|---|---|---|
2002 | 987 | |
1947 | 360 | |
2004 | 355 | |
2006 | 325 | |
1991 | 283 | |
1993 | 250 | |
1995 | 230 | |
2010 | 196 | |
2007 | 193 | |
1999 | 182 |
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