Slicing parameters optimizing and experiments based on constant wire wear loss model in multi-wire saw

A wafer-based monocrystalline silicon photovoltaics road map: Utilizing known technology improvement opportunities for further reductions in manufacturing costs

Alan Goodrich, Peter Hacke, Qi Wang et al. · Solar Energy Materials and Solar Cells · 2013 · 318 citations

Engineering, Materials Engineering, Materials Science +16

Basic Mechanisms and Models of Multi‐Wire Sawing

H.J. Möller · Advanced Engineering Materials · 2004 · 216 citations

Engineering, Manufacturing Engineering, Materials Science +16

Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis

Milind Bhagavat, V. Prasad, Imin Kao · Journal of Tribology · 1999 · 89 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +16

VIBRATION ANALYSIS OF WIRE AND FREQUENCY RESPONSE IN THE MODERN WIRESAW MANUFACTURING PROCESS

Songbin Wei, Imin Kao · Journal of Sound and Vibration · 2000 · 66 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +10

Acoustic transducers with a perforated damping backplate based on PZT/silicon wafer bonding technique

Zhihong Wang, Jianmin Miao, Chee Wee Tan · Sensors and Actuators A Physical · 2008 · 48 citations

Natural Sciences, Mechanical Engineering, Physics +13