Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions

Reliable determination of chemical state in x-ray photoelectron spectroscopy based on sample-work-function referencing to adventitious carbon: Resolving the myth of apparent constant binding energy of the C 1s peak

Grzegorz Greczyński, Lars Hultman · Applied Surface Science · 2018 · 1.4K citations

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C 1s Peak of Adventitious Carbon Aligns to the Vacuum Level: Dire Consequences for Material's Bonding Assignment by Photoelectron Spectroscopy

Grzegorz Greczyński, Lars Hultman · ChemPhysChem · 2017 · 1K citations · Full text

Natural Sciences, Chemistry, Materials Science +14

Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang, K. N. Tu · Materials Science and Engineering R Reports · 2014 · 322 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Haozhong Wang, Xiaowu Hu, Xiongxin Jiang · Materials Characterization · 2020 · 233 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16