2021 · 10 citations · 12 references
EngineeringComputer EngineeringComputer ScienceComputer ArchitectureLow-power DesignSystem-on-chip DesignMemory Hierarchy DesignMemory Subsystem DesignMicroarchitecture DesignMulticore Processor DesignPhysical DesignPower ManagementCost Savings AnalysisDie-to-wafer BondingDirect Wafer BondingManycore ArchitecturesMemory Footprint ReductionPower-performance-area TradeoffsProcessor ArchitectureWafer-to-wafer Bonding
In this paper, we present a power, performance, area and cost (PPAC) analysis for large-scale 3D processor designs based on wafer-to-wafer bonding. From the evaluation of our cost model, we investigate a typically disregarded opportunity in 3D that is area savings due to buffer savings and better routability, offering unexpected cost savings. We explore the viability of this factor with the feedback of a state-of-the-art 3D memory-on-logic implementation flow. We show how this affects the PPAC of full-chip GDS implementations of a large-scale manycore processor design. Experiments show that our memory-on-logic 3D implementation offers 7% silicon area savings, resulting in 53.5% footprint reduction. We also obtain a 40% power-performance-cost improvement compared with 2D counterparts
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Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 135 citations