Publication | Open Access
Architecture and Process Integration Overview of 3D NAND Flash Technologies
68
Citations
70
References
2021
Year
Non-volatile MemoryEngineeringComputer ArchitectureScaling LimitNand Flash Memory3D MemoryAdvanced Packaging (Semiconductors)NanoelectronicsElectronic PackagingMaterials Science3D Ic ArchitectureElectrical EngineeringFlash MemoryComputer EngineeringMicroelectronics3D PrintingNand Flash TechnologiesMicrofabricationThree-dimensional Heterogeneous IntegrationApplied PhysicsSemiconductor MemoryTechnology3D Integration
In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.
| Year | Citations | |
|---|---|---|
Page 1
Page 1