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Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
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2009
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Materials Science3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationChip AttachmentElectronic PackagingMicroelectronics300-Mm-compatible 3Di3D Printing
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