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Publications
1
Citations
19
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Active since
2009
Yu is an author specializing in die-to-wafer bonding, adhesive bonding, and microelectronics.
Publications per year
2009–2009
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
Yu, Polastre, Chen et al. · Symposium on VLSI Technology · 2009 · 19 citations
Engineering, Materials Engineering, Materials Science +14
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