Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration

Abstract

In this article, we have demonstrated 125-nm-gate InGaAs-on-insulator (InGaAs-OI) high-electron-mobility transistors (HEMTs) on Si substrates via wafer bonding. The highlights of this device were the i-In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.53</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.47</sub> As/i-InAs/i-In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.53</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.47</sub> As quantum-well channel for high RF performance by improving electron transport properties and the low processing temperature of 250 °C or less for monolithic 3-D integration. As a result, we obtained a current gain cutoff frequency ( f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> T</sub> ) of 227 GHz and a maximum oscillation frequency ( f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">MAX</sub> ) of 187 GHz. These results are the highest ever reported in monolithic 3-D RF transistors above L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">G</sub> = 100 nm. In addition, through the small-signal modeling, we have found that the impact of the back-gate (BG) on RF performances of top devices is a critical issue in M3D RF systems.