Dishing-free chemical mechanical planarization for copper films

Sang-Su Yun, Young-Hye Son, Gi-Ppeum Jeong, Je-hwan Lee, Jong-han Jeong, Jae-Young Bae, Sung In Kim, Jin-Hyung Park

Colloids and Surfaces A Physicochemical and Engineering Aspects · 2021 · 20 citations · 42 references

Concepts

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