High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

Abstract

In this paper, a multilayered integrated inductor in Fan-out Wafer Level Packaging (FoWLP) technology is investigated. The inductor is designed on polyimide for integration into the redistribution layer of the package. Excellent correlation is obtained between simulation and measurement results. The fabricated inductor has an inductance of approximately 480 pH and a quality factor of approximately 27 at 11 GHz.