Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing - Concepedia

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Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing

24

Citations

34

References

2021

Year

Siou-Han Hu, Ting-Chun Lin, Chin-Li Kao, Fei-Ya Huang, Yi-Yun Tsai, Shih-Chieh Hsiao, Jui‐Chao Kuo

Microelectronics Reliability

Materials EngineeringMaterials ScienceBismuth AdditionsEngineeringMechanical EngineeringSac-bi Solder JointCurrent StressingMechanics Of MaterialsMicrostructure

References

	Year	Citations

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