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Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films

Materials EngineeringMaterials ScienceEngineeringMaterial PropertyBonding StrengthNanotechnologyNanotwinned Copper FilmsSurface ScienceApplied PhysicsMetallic Functional MaterialAnisotropic Grain GrowthMetallic NanomaterialsThin FilmsMicrostructure