Publication | Closed Access
Hot-Electron Effects in AlGaN/GaN HEMTs Under Semi-ON DC Stress
60
Citations
12
References
2020
Year
Semiconductor TechnologyWide-bandgap SemiconductorElectrical EngineeringEngineeringPhysicsApplied PhysicsCondensed Matter PhysicsAluminum Gallium NitrideGan Power DeviceHot-electron EffectsDynamic ResistanceOff-state StressAlgan/gan High-electron-mobility Transistors
An analysis of hot-electron (HE) effects on the dynamic resistance (dR <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> ) of AlGaN/GaN high-electron-mobility transistors (HEMTs) when subject to semi-ON stress is reported and compared with OFF-state stress. This is carried out using measurements and TCAD 2-D hydrodynamic simulations. Two structures with different distances between the highly carbon-doped buffer region and the two-dimensional electron gas (2DEG) are here considered. The additional dR <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> in semi-ON is attributed to HEs trapping at the passivation/AlGaN interface. TCAD simulations are performed and compared with experimental results.
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