Multichannel Parallel Testing of Intermittent Faults and Reliability Assessment for Electronic Equipment

Abstract

Many connections exist in complex electronic equipment, which leads to a long duration of intermittent fault test and difficulty in achieving comprehensive coverage of intermittent fault. The intermittent fault mechanism and the multichannel intermittent fault parameter parallel capture method are investigated. A smaller module covers multiple intermittent connection faults in electronics and prevents missed detections. Based on the test results, a reliability assessment of the connection link with intermittent faults is needed in the next step. The correlation between the intermittent fault parameters and the reliability of connection link is analyzed, and the intermittent fault parameters are used to evaluate the connection link reliability. An aviation electrical connector and solder joint are used for testing. The results show that increases in the intermittent fault parameters are consistent with the trend of reliability degradation, which indicates that the proposed method can be applied to intermittent fault testing and reliability assessment for the connection link of electronic equipment.