Publication | Closed Access
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions
42
Citations
31
References
2020
Year
Materials ScienceFriction WeldingEngineeringSuperalloyMechanical EngineeringHot WorkingMicrostructure EvolutionThermomechanical ProcessingMicrostructureCeramic Matrix Composite
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