Azmah Hanim Mohamed Ariff

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

T.T. Dele‐Afolabi, M.N.M. Ansari, Azmah Hanim Mohamed Ariff et al. · Journal of Materials Research and Technology · 2023 · 86 citations · Full text

Engineering, Mechanical Engineering, Interlayer Materials +22

Effects of CNTs content and milling time on mechanical behavior of MWCNT-reinforced aluminum nanocomposites

Farhad Ostovan, Khamirul Amin Matori, Meysam Toozandehjani et al. · Materials Chemistry and Physics · 2015 · 68 citations

Materials Science, Reinforcement Material, Metal Matrix Composite +9

Tensile and Compressive Properties of Woven Kenaf/Glass Sandwich Hybrid Composites

Mohaiman J. Sharba, Zulkiflle Leman, Mohamed Thariq Hameed Sultan et al. · International Journal of Polymer Science · 2016 · 63 citations · Full text

Materials Science, Textile Composites, Composites +13

Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes

T.T. Dele‐Afolabi, Azmah Hanim Mohamed Ariff, Hamdan Mohamed Yusoff et al. · Journal of Alloys and Compounds · 2015 · 51 citations

Materials Science, Engineering, Composite Technology +5

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate

T.T. Dele‐Afolabi, Azmah Hanim Mohamed Ariff, Oluwatosin J. Ojo-Kupoluyi · Journal of Alloys and Compounds · 2019 · 48 citations

Materials Science, Cu Substrate, Engineering +5