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Influence of interfacial intermetallic compound on fracture behavior of solder joints

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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

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Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

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Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate

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