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Direct Room Temperature Welding and Chemical Protection of Silver Nanowire Thin Films for High Performance Transparent Conductors

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Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Myung Jin Yim, Yi Li, Kyoung‐sik Moon et al. · Journal of Adhesion Science and Technology · 2008 · 177 citations

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Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry

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Natural Sciences, Materials Engineering, Materials Science +14