Quarter-mm² High Dynamic Range Silicon Capacitive Accelerometer With a 3D Process

Abstract

A new 3D process is proposed for inertial MEMS sensors where a thin transduction layer based on high-density surface-varying comb fingers, with nano-metric gaps, is patterned below a thick seismic mass layer. The objective is to achieve high-performance in a reduced footprint. An inplane accelerometer is designed, fabricated with this new 3D process, and tested under acceleration. Initial fabricated devices demonstrate a full-scale range of ±160 g, 7 μg/√(Hz) Brownian noise floor and more than 4 kHz bandwidth. These figures translate into a dynamic range of more than 150 dB (normalized to 1-Hz bandwidth) with an overall footprint of only 400 × 600 μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .