IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 10 citations · 11 references
EngineeringElectrical EngineeringAntennasMicrowave EngineeringPhotonicsHigh-frequency Semiconductor DevicesMicrowave PackagingMicrowave System DesignMicrowave Transmission LinesMillimeter-wave CommunicationsWaveguidesBandwidthElectromagnetic Field SimulationFractional BandwidthMicrowave Packaging DesignPackaging For High-frequency DevicesRadio-frequency PackagingRidge WaveguidesWaveguide Design
In this letter, a ridge gap waveguide (RGW) layer transition is proposed for compact 3-D packaging application. The RGW layer transition can increase the layout space in the vertical direction of the RGW packaging. The proposed RGW layer transition consists of a normal RGW, a double RGW (DRGW), and an inverted RGW (IRGW). The electromagnetic field coupling between different RGW layers is achieved using a double-ridge probe. Finally, a back-to-back RGW layer transition prototype is designed and fabricated. The measured results show an operating frequency ranging from 37.7 to 43.5 GHz, with a fractional bandwidth of 14.3%. Within the working frequencies, the return losses are better than 12 dB and the insertion losses are around 1.2 dB. There is a good agreement between the measurements and the simulations.
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Yongrong Shi, Junzhi Zhang, Ming Zhou et al. · IEEE Transactions on Circuits & Systems II Express Briefs · 2019 · 46 citations
Engineering, Electrical Engineering, Microelectromechanical Systems +16