Integrated High Power Micro Magnets for MEMS Sensors and Actuators

Abstract

Back-end-of-line compatible integration of NdFeB-based micro magnets onto 8 inch Si substrates is presented. Substrate conditioning procedures to enable further processing in a cleanroom environment are discussed. It is shown that permanent magnetic structures with lateral dimensions between 25μm and 2000μm and a depth up to 500μm can be fabricated reliably and reproducibly with a remanent magnetization of 340mT at a standard deviation as low as 5% over the substrate. To illustrate post-processing capabilities, the fabrication of micro magnet arrangements embedded in silicon frames is described.