2019 · 10 citations · 1 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesThermal AnalysisDevice ModelingHeat ConductionHeat Transfer ModelingIntegrated Circuit DesignThermal DesignThermal ManagementHeat Stress AccumulationSelf-heating EffectsSelf-heating ModelingTemperature Distribution AnalysisThermal Impedance ModelingThermal Network ModelingTransient Thermal EvolutionTransient Thermal Networks
This paper presents a 3D thermal impedance network approach to study self-heating effects in advanced FinFETs that are difficult to be analyzed in conventional models: (i) temperature distribution analysis for large FinFET devices used in high current drivers (ii) transient thermal modeling for heat accumulation in GHz digital circuits, and (iii) investigation for layout methods to reduce FinFET self-heating temperature.
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