Etching Mechanisms and Surface Conditions for SiOxNy Thin Films in CF4 + CHF3 + O2 Inductively Coupled Plasma - Concepedia

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Etching Mechanisms and Surface Conditions for SiOxNy Thin Films in CF4 + CHF3 + O2 Inductively Coupled Plasma

11

Citations

45

References

2019

Year

Junmyung Lee, Jihun Kim, Alexander Efremov, Changmok Kim, Hyun‐Woo Lee, Kwang‐Ho Kwon

Plasma Chemistry and Plasma Processing

References

	Year	Citations

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