3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating

Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing

H. Kim · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2003 · 541 citations

Natural Sciences, Materials Engineering, Materials Science +17

<i>In situ</i>spectroscopic ellipsometry as a versatile tool for studying atomic layer deposition

E. Langereis, S. B. S. Heil, Harm C. M. Knoops et al. · Journal of Physics D Applied Physics · 2009 · 289 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reaction Mechanism Studies on Atomic Layer Deposition of Ruthenium and Platinum

Titta Aaltonen, Antti Rahtu, Mikko Ritala et al. · Electrochemical and Solid-State Letters · 2003 · 239 citations

Natural Sciences, Chemistry, Materials Science +13

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

Thomas P. Moffat, Mitchell L. R. Walker, P. J. Chen et al. · Journal of The Electrochemical Society · 2005 · 115 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Fumihiro Inoue, Harold Philipsen, Aleksandar Radisic et al. · Electrochimica Acta · 2013 · 57 citations

Engineering, Materials Engineering, Materials Science +17