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Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

Materials ScienceMaterials EngineeringElectrical EngineeringSinteringEngineeringDie AttachmentApplied PhysicsSemiconductor Device FabricationElectronic PackagingChemical Vapor DepositionMicroelectronicsEnig FinishNanosilver PasteSilicon On InsulatorSurface Processing