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Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyMaterial ProcessingMaterial MachiningRemoval MechanismMechanical EngineeringApplied PhysicsSurface ScienceSurface/subsurface CharacteristicsCarbideMachiningAbrasive MachiningMicrostructure