Publication | Closed Access
Sequential combined thermal cycling and vibration test and simulation of printed circuit board
12
Citations
7
References
2018
Year
Electrical EngineeringEngineeringMechanical EngineeringThermal CyclingMechanical SystemsThermal ManagementThermal AnalysisThermal ModelingCircuit BoardElectronic PackagingHeat TransferThermal EngineeringVibration Test
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