Thermographic Approach for Reliability Estimation of PCB

Abstract

The possibilities and specifics of the application of the thermographic non-destructive diagnostics in the development and production of PCBs are analyzed. Methods for evaluation of the temperature regimes of the electronic elements and their impact on the reliability of the PCB are noted. The problems in determining the reliability of the PCB elements according to thermographic diagnostics data are presented. A methodology for reliability evaluation of both individual components and PCBs in the operating temperature range is proposed. Thermographic measurements of test and real operating PCBs were performed. An approach is presented to automate the process of thermal control using infrared.