Formation and Ripening of Self-Assembled Multilayers from the Vapor-Phase Deposition of Dodecanethiol on Copper Oxide

Abstract

Here, the vapor-phase reaction of dodecanethiol (DDT) with copper oxide surfaces and the molecular level composition and structure of the resulting films were examined. Atomic force microscopy, cross-sectional transmission electron microscopy, and electron energy loss/electron dispersive spectroscopy reveal that, instead of forming self-assembled monolayers, DDT etches CuO surfaces to create ~8 nm thick Cu-thiolate multilayers. These layers are composed of surprisingly well-ordered crystallites, oriented either parallel or perpendicular to the substrate surface. Pre-etching of the CuO to expose the underlaying copper metal is shown to prevent the formation of multilayers and instead allow for the formation of the expected monolayers. Water contact angle and Fourier transform infrared spectroscopy are further shown to be ineffective at distinguishing the multilayer and monolayer thiol films. Interestingly, the multilayer films are unstable in air, ripening into particles 20 μm wide and several hundred nanometers tall over the course of a week. Air exposure also leads to the slow oxidation of the sulfur and copper within the films at a rate similar to what has been seen before for DDT monolayers. As a result, the multilayers show no significant improvement over monolayers in the prevention of oxidation.