2018 · 14 citations · 4 references
Semiconductor TechnologyElectrical EngineeringElectronic DevicesEngineeringRepetitive Sc EventsPhysicsInterconnect (Integrated Circuits)Applied PhysicsSemiconductor MaterialIntegrated CircuitsNon-destructive Current FilamentsMicroelectronicsCurrent FilamentsSemiconductor Device
In this paper, we demonstrate for the first time experimentally measured current filaments in IGBTs under repetitive Short-Circuit (SC) events. These current filaments were discovered with the help of Thermo-Reflectance Microscopy (TRM). The destruction current as function of the applied collector-emitter voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CE</sub> ) was determined for two differently wire-bonded 15A-1200V IGBT chips. The repetitive SC events in combination with TRM measurement indicate a wide range of non-destructive current filaments at different V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CE</sub> . Similar filament formation under short-circuit conditions were observed in supporting TCAD device simulations based on multi-cell IGBT structure. These filaments have similar dimensions to the current filaments measured by TRM.
4
CCD-based thermoreflectance microscopy: principles and applications
M. Farzaneh, Kerry Maize, D. Lüerßen et al. · Journal of Physics D Applied Physics · 2009 · 266 citations
Limitation of the short-circuit ruggedness of high-voltage IGBTs
A. Kopta, Munaf Rahimo, U. Schlapbach et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 2009 · 49 citations
Electrical Engineering, Engineering, Destruction Mechanism +10