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Low Inductive SiC Power Module Design Using Ceramic Multilayer Substrates

Thomas Huber, Olivier Mathieu

mediaTUM – the media and publications repository of the Technical University Munich (Technical University Munich) · 2018 · 19 citations · 3 references

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3

Ultra-low inductive power module design with integrated common mode noise shielding

Thomas Huber, Alexander Kleimaier, Ralph Kennel · 2017 · 23 citations · Full text

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Low-inductive compact SiC power modules for high-frequency operation

Michael Meißer, Dean Hamilton, Thomas Blank et al. · DMU Open Research Archive (De Montfort University) · 2014 · 14 citations

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Low parasitic inductance multi-chip SiC devices packaging technology

Bassem Mouawad, Jianfeng Li, Alberto Castellazzi et al. · 2016 · 14 citations · Full text

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