CIRP Annals · 2018 · 10 citations · 13 references
EngineeringMaterials EngineeringMaterials ScienceHeat TransferManufacturing ProcessesMaterials ProcessingCoating ProcessesCoatingsFabrication MaterialsHeat TreatmentSubstrate PreparationWafer BondingConvective Heat TransferHeat Transfer CoefficientsHeat Transfer EnhancementManufacturingSiliconSilicon Wafer ProcessingSilicon WafersWafer Materials
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Bonding mechanism in cold gas spraying
H. Assadi, F. Gärtner, T. Stoltenhoff et al. · Acta Materialia · 2003 · 1.7K citations
Hongquan Jiang, Sorin Manolache, Amy C. Lee Wong et al. · Journal of Applied Polymer Science · 2004 · 294 citations
Natural Sciences, Materials Engineering, Materials Science +17
Thermal Conductivity of Diamond Composites
Fedor M. Shakhov · Materials · 2009 · 287 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17