Wafer‐scale monolithic hybrid integration of <scp>Si</scp>‐based <scp>IC</scp> and <scp>III–V</scp> epi‐layers—A mass manufacturable approach for active matrix micro‐<scp>LED</scp> micro‐displays

TLDR

Hybridization of silicon ICs with compound semiconductor arrays is crucial for functional hybrid chips, yet flip‑chip technology limits high‑density arrays without increasing footprint. Beida Jade Bird Display Limited developed a wafer‑level monolithic hybrid integration technology to overcome these limitations and enable large‑scale functional device arrays on Si IC wafers. The method integrates III‑V epitaxial layers onto Si IC wafers at wafer scale, allowing monolithic hybrid integration of functional device arrays. Using this technology, active‑matrix micro‑LED displays with over 5000 ppi were fabricated, demonstrating superior performance to other micro‑display technologies and enabling low‑cost mass production for portable projectors and augmented‑reality applications.

Abstract

Abstract Hybridization of silicon integrated circuits (ICs) with compound semiconductor device arrays are crucial for making functional hybrid chips, which are found to have enormous applications in many areas. Although widely used in manufacturing hybrid chips, the flip‐chip technology suffers from several limitations that are difficult to overcome, especially when the demand is raised to make functional hybrid chips with higher device array density without sacrificing the chip footprint. To address those issues, Beida Jade Bird Display Limited has developed its unique wafer‐level monolithic hybrid integration technology and demonstrated its advantages in making large‐scale hybrid integration of functional device arrays on Si IC wafers. Active matrix micro‐light‐emitting diode micro‐displays with a resolution of 5000+ pixel per inch were successfully fabricated using Beida Jade Bird Display Limited's monolithic hybrid integration technology. The general fabrication method is described, and the result is presented in this paper. The fabricated monochromatic micro‐light‐emitting diode micro‐displays exhibit improved device performance than do other micro‐display technologies and have great potentials in applications such as portable projectors and near‐to‐eye projection for augmented reality. More importantly, the wafer‐scale monolithic hybrid integration technology offers a clear path for low‐cost mass production of hybrid optoelectronic IC chips.