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Effect of thermal annealing on AlN films grown on sputtered AlN templates by metalorganic vapor phase epitaxy
49
Citations
33
References
2017
Year
Aln FilmAluminium NitrideEngineeringCrystal Growth TechnologySputtered Aln TemplatesChemical DepositionStacking StructureMolecular Beam EpitaxyEpitaxial GrowthThin Film ProcessingMaterials EngineeringMaterials ScienceCrystalline DefectsAln FilmsMicrostructureSurface ScienceApplied PhysicsThin FilmsChemical Vapor Deposition
To obtain low-dislocation-density c-plane AlN on sapphire, we have studied the annealing of AlN films at 1650 °C. We prepared an AlN film with a thickness of 20 nm by radio-frequency (RF) sputtering, on which an AlN epilayer with a thickness of 280 nm was grown by metalorganic vapor phase epitaxy (MOVPE) at different growth temperatures. Finally, the AlN film on sapphire was annealed at 1650 °C. The full width at half maximum (FWHM) of the X-ray rocking curve (XRC) for AlN(0002) was approximately 50 arcsec for all samples, whereas that for AlN() significantly decreased from 6500 to 350 arcsec after thermal annealing. A surface morphology with atomic steps and a terrace structure was clearly observed after thermal annealing. From these results, we concluded that a high-quality AlN film can be obtained by annealing a stacking structure of MOVPE-grown AlN (buffer layer)/sputtered AlN (nucleation layer)/sapphire substrate.
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