A New Microfabrication Method for Ion-Trap Chips That Reduces Exposure of Dielectric Surfaces to Trapped Ions

Abstract

Accumulated electrostatic charges on the dielectric surfaces of ion traps are known to induce stray fields, leading to ion micromotions. In typical microfabricated ion-trap chips, metal electrodes are electrically isolated using thick dielectric pillars, which can accumulate stray charges on their sidewalls. This letter presents a new microfabrication method for ion-trap chips that reduces the exposure of dielectric surfaces to trapped ions. The dielectric pillars are fabricated with large T-shaped overhangs, and the sidewalls and top surfaces are coated with AlCu (1%) films. The bottom sides of the overhang parts provide electrical isolation. To prevent oxidation of the AlCu (1%) films, the electrode surfaces are coated with an additional Au film. The fabricated chips were implemented to trap <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">174</sup> Yb <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> ions, and the laser-induced stray fields were measured. The results indicated that the trap chip fabricated by the newly developed method generates significantly smaller stray fields as compared with previous chips. [2017-0233]